AI’s memory bottleneck: what investors should know about supply constraints
We see memory as an increasingly important bottleneck in the AI build-out. Advanced AI systems require not only more processors, but also high-bandwidth memory, or HBM, to move and process large amounts of data quickly. As demand for AI compute grows, HBM has become a key constraint across parts of the semiconductor value chain.
We believe this supply constraint is real and could persist for some time. Adding advanced memory capacity is difficult and time-consuming. New cleanroom space can take years to build, and based on our current assessment, limited meaningful new capacity may become available across major producers before late 2027 or early 2028. A broader supply-and-demand balance may take longer to emerge, although timing remains uncertain and subject to change.
The key point is that HBM does not simply add a new product category to the memory market — it also uses scarce manufacturing capacity. Producing HBM requires materially more wafer capacity per bit than conventional DRAM, and that capacity burden tends to increase with each new generation. As producers allocate more resources to HBM, supply in conventional DRAM can also tighten. This is why higher capital spending does not necessarily translate one-for-one into more usable memory supply. Memory remains cyclical, and a correction at some point would be normal. However, this cycle has some distinguishing features: demand is increasingly linked to AI infrastructure spending, the supply response is constrained by physical capacity, and longer-term customer agreements could support greater durability than in prior cycles. Investors should continue to watch for signs of new supply, softening demand or inventory accumulation.